Electronic systems across the board are decreasing in size while increasing in performance. In compact and portable products ranging from cell phones to smart weapons, high-density integration (HDI) technology is enabling the design of smaller end products that meet higher standards for electrical performance and efficiency. HDI boards themselves are low-noise products that integrate conductor patterns and other passive components in custom resistor solutions. With enhanced signal routing and response conditioning, HDI technology enables greater wiring density and closer component spacing. All these improvements are possible thanks to the use of thin film, high-density multilayer substrates. Because these devices can be tremendously complex and their design tied tightly to the end-product performance, most HDI boards are custom-designed to meet the specific requirements of a given application and to deliver the best ratio of price to performance. The design process involves a series of critical decisions that will shape the performance of the HDI and its aptitude for the target application.
