Quick Leads
Top 5 Common Wave Soldering Defects and How to Fix Them
Wave soldering is a big deal in PCB manufacturing. But even small problems can cause big delays and quality problems. You need to know how to spot and fix the most common defects. Here are the top five wave soldering defects and how to fix them.
The five most common wave soldering defects are insufficient hole fill, solder bridging, lifted components, solder balling, and cold solder joints.
These defects usually happen because you didn’t preheat right, your solder temperature wasn’t right, or you didn’t place the components right. If you understand these problems and fix them, you’ll make better boards.
Let’s look at each defect, what causes it, and how to fix it.
1. How to Fix Insufficient Hole Fill in Wave Soldering?
Overview: Insufficient hole fill is when the solder doesn’t go all the way through the holes. This can cause bad connections and make your board not work right.
Causes:
- Improper preheat.
- Low solder pot temperature.
- Rapid conveyor speed.
Solutions:
- Adjust solder pot temperature: Ensure the solder remains at a proper viscosity.
- Optimize the preheat stage: Drive off moisture and enhance solder flow.
- Reduce conveyor speed: This gives the solder enough time to fill the holes thoroughly.
Pro Tip:
Keep your solder pot between 240°C and 260°C.
2. Prevent Solder Bridging: Tips for Wave Soldering Success
Overview: Solder bridging is when the solder connects two things that aren’t supposed to be connected. This can cause shorts and mess up your board.
Causes:
- Close pin spacing.
- Low wave temperature.
- Excessive solder application.
Solutions:
- Use a proper solder mask design: Minimizes the likelihood of bridging.
- Increase wave temperature: Improves solder flow and prevents pooling.
- Ensure optimal flux application: Reduces surface tension, promoting even solder flow.
Pro Tip:
Keep your soldering equipment clean and working right so you don’t get solder bridges.
Image 2: Below this section.
3. Causes of Lifted Components During Wave Soldering
Overview: Lifted components happen when you don’t solder right and the parts stick up or fall off. This can make your board break and not work.
Causes:
-
Insufficient flux.
-
Improper preheat.
-
Uneven wave pressure.
Solutions:
-
Ensure even flux application: Improves solderability.
-
Adjust preheat settings: Make sure your board and parts get hot enough before they go into the wave.
-
Verify wave uniformity: Consistent pressure across the entire board maintains component placement.
Pro Tip:
Check your flux to make sure it’s good enough to use.
4. Preventing Solder Balling in PCB Wave Soldering
Overview: Solder balls are little balls of solder that can be on your board. They can cause shorts and make your board look bad.
Causes:
-
Excess moisture in the flux.
-
Rapid cooling.
-
Excessive solder.
Solutions:
-
Thoroughly dry the PCB: Reduces moisture-related issues.
-
Adjust cooling rates: Prevents the solder from solidifying too quickly.
-
Monitor solder application: Ensure it stays within optimal levels.
Pro Tip:
Keep your boards dry before you solder them so you don’t get solder balls.
5. How to Prevent Cold Solder Joints in Wave Soldering?
Overview: Cold solder joints happen when the solder doesn’t stick to the part and the board. This makes a weak joint that can make your board not work right.
Causes:
-
Insufficient heat.
-
Poor flux activity.
-
Incorrect wave parameters.
Solutions:
-
Increase wave temperature: Ensures adequate heat delivery.
-
Use a more active flux: Improves the wetting action of the solder.
-
Adjust dwell time: Allows the solder to properly bond to the components.
Pro Tip:
Make sure the wave goes over your board for 2-4 seconds so the solder gets hot enough.
Summary Box for Quick Reference
|
Defect |
Quick Fix |
|
Insufficient Hole Fill |
Adjust solder temperature, optimize preheat, slow conveyor speed |
|
Solder Bridging |
Use proper solder mask, increase wave temperature |
|
Lifted Components |
Ensure even flux application, verify wave uniformity |
|
Solder Balling |
Dry PCB thoroughly, adjust cooling rates |
|
Cold Solder Joints |
Increase wave temperature, adjust dwell time |
Limited Time Offer:
Get $100 off your order TODAY!
Claim your $100 discount now – this offer won’t last long! Today ONLY!
Don’t miss this chance to save on your next project.
[Hurry! Only 50 discounts remaining!]
Trusted by 100+ businesses worldwide No hidden fees – transparent pricing Guaranteed quality with on-time deliverFrequently Asked Questions (FAQ)
The best wave soldering temperature is usually between 240°C and 260°C, depending on the solder alloy you are using. Staying within this range will give you good flow and good joints.
To avoid cold solder joints, make sure your wave is hot enough, use a more active flux, and adjust the dwell time to get better heat transfer.
Solder balling is often caused by moisture in the flux or by cooling too fast. To prevent it, dry your boards really well before you solder them and adjust your cooling rates to allow for gradual solidification.
Need help dialing in your wave soldering process? Contact our experts for a consultation. Have a specific wave soldering challenge? Reach out for personalized advice!
Having trouble with wave soldering defects like bridging, cold joints, or lifted components? Above shows you the top 5 defects and solutions to improve your PCB assembly quality.
Request for Quote
RECENT POSTS
RELATED POSTS
Leading PCBA Manufacturer
✅ Assemble 20 PCBAS for $0 ✅ Get $100 OFF – Risk-Free Trial!
✅ 100+ Satisfied Customers
✅ Ensured Quality & On-Time Delivery
✅ Free Trial, No Commitments!